Phenol Molding Powder (Compression Grade)

Our compression-grade phenol molding powder is a high-performance thermosetting compound specifically designed for compression and transfer molding processes. This material offers excellent mechanical strength, thermal stability, and electrical insulation properties for industrial applications requiring durability under extreme conditions.

Technical Specifications

Property	Specification
Appearance	Granular powder (various colors available)
Bulk Density	0.5-0.7 g/cm³
Cure Time	120-180 seconds at 170°C (depending on thickness)
Specific Gravity	1.35-1.50
Water Absorption	≤0.6% (24 hours)
Flexural Strength	90-110 MPa
Impact Strength	8-12 kJ/m²
Heat Deflection Temperature	>160°C
Dielectric Strength	14-17 kV/mm
Filler Content	60-80% (depending on grade)

Applications

Compression-grade phenol molding powder is ideal for manufacturing robust components requiring excellent mechanical and electrical properties:

Heavy-Duty Electrical Components: Circuit breaker housings, high-voltage insulators
Automotive Components: Brake system components, transmission parts
Industrial Equipment: Pump housings, valve bodies, and structural components
Appliance Parts: Heat-resistant handles, knobs, and structural elements
Aerospace Components: Non-critical structural elements and electrical insulators

Advantages

Excellent mechanical strength and impact resistance
Superior thermal stability at elevated temperatures
Outstanding electrical insulation properties
Excellent dimensional stability after molding
Good chemical resistance to oils, fuels, and mild chemicals
Flame retardant properties without additional additives

Packaging & Storage

Available in 25kg moisture-resistant bags or 500kg bulk bags. Store in cool, dry conditions away from direct sunlight. Recommended storage temperature below 25°C with relative humidity below 60% to prevent premature curing or moisture absorption.

Request Information

Contact our technical team for detailed specifications, safety data sheets, and customized solutions for your specific application requirements.